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Home> Ngwaahịa> Plastik plastik> Peek mpempe akwụkwọ> Peek maka semiconductor TecAPapeak®cMP
Peek maka semiconductor TecAPapeak®cMP
Peek maka semiconductor TecAPapeak®cMP
Peek maka semiconductor TecAPapeak®cMP

Peek maka semiconductor TecAPapeak®cMP

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Enweghi ike:FOB,CFR,CIF,EXW,DDU
Min. Nhazi:1 Kilogram
Ụgbọ njem:Ocean,Land,Air,Express
Port:Shenzhen,Guangzhou,Hongkong
Njirimara Ngwaahịa

Ihe Nlereanya.TECAPEEK®CMP natural

EkeTecpead

Nkwakọ ngwaahịa & nzipu
Ere Ngwa : Kilogram
Agedị ngwugwu : Ngwugwu mbupụ

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Nchikota onu ogugu
Peek mpempe akwụkwọ Rod na CNC
Nkọwapụta ngwaahịa

Edebere Tecapeekeeke Etione na-emepụta ihe maka ngwa mgbanaka CMP ma bụrụ akụkụ nke Pọtụị Pọtụnger maka ụlọ ọrụ semiconductor. Ọ bụ ihe na-enweghị atụ (Polyletathetone) na VICTEX® Pes Njirimara na CMP na-eme ka ọ dị obere na-eyi (ma e jiri ya tụnyere plastik peek, nke na-ebelata ihe ọghọm nke adịghị mma. N'ime ihe CMP na-ejigide akwụkwọ mgbanaka, Tecapeeked cmP na-enye ihe kachasị mma na nke a na-ekwu okwu na-ekwu okwu, Njirimara arụ ọrụ, na ọnọdụ okpomọkụ na-enyere gị aka na ndụ mgbanaka kachasị ogologo.

TECAPEEK CMP natural

Ebe ọ bụ na ndị na-eguzogide nke plastik peek dị mma karịa nke pps, na tecpeeked cm nwere 20% na-eyiri uru na-agbagide ngwaahịa Piech na ndụ ọrụ.


N'ozuzu, a na-agbanwere ndị na-eri nri na ọtụtụ nke otu nwere ndụ kacha mkpụmkpụ, na-abụkarị pad. N'ihi ya, a na-ahazi oge mmegharị oge mgbanaka na pad "olulu kwụsị". Dịka ọmụmaatụ, n'okpuru ọnọdụ ụfọdụ, mgbaaka PPS nwere ike ịdịru ya maka mgbanwe 4, akwụkwọ mgbaaka nwere ike ịdị na-agbanwe na mgbanwe paịlị iri na abụọ, yana tic cmp mgbanaka nwere ike ị ga-anọ na-agbanwe. Nke a nwere mmetụta dị mma dị mma na ọnụego mgbanwe ụda na ọnụego nke ịnwe.


Na mgbakwunye na njikarịcha ihe onwunwe, ensinger enwewokwa nha pụrụ iche nke dabara adaba na mgbaaka nke CMP na-ejigide, si otú a na-eme ka ihe mkpofu na ọnụ ahịa belata. Iji maa atụ, site na iji nha tube na OD 350 mm / id 300 m na-enyere aka na $% ihe eji atụ ego ma e jiri ya tụnyere od 360 / id 290 mm.


Dịka ya na akara ngosi secumer niile, a na-ahazi mkpụrụ osisi seconductor dị iche iche na Semitoponductor Detuo ihe (nke a ma ama dị ka OA) na njikwa ogo dị egwu. Njikwa ogo kachasị mma na usoro na-enyere belata ihe egwu nke adịghị mma ma nwee nrụgide nke ime ma sie ya iji tụchie ya na plastiklọ ọrụ mmepụta ihe. Anyị nwere ike gosi na Tecpieke dị iche iche na-ezute oke mgbochi nke Rohs na-akwado Rohs na-akwado ihe dị ize ndụ na akụrụngwa ngwa eletriki, yana ike inye ndị ọzọ nkwupụta ọzọ.


Maka mgbaaka CMP na-achọ ihe dị ala na ebe enwere ike itinye ego na mpaghara dị ala, onye na-enye onyinye PPS - Tecatron cmp, yana profaịlụ ihe onwunwe pụrụ iche na-eme ka mgbanaka CMP. Maka ngwa Somiconductor ndị ọzọ anaghị achọ profaịlụ nke ihe onwunwe a, na-enye ụdị ihe dị iche iche dị na-arụ ọrụ nke ọma dị ka efere, mkpanaka, na tubes - tecapeeks sx.


Eziokwu

Ngosipụta kemịkal

Peek (Polyhathattetone)

Agba

edo edo

Keuju

1.31 g / cm3


Isi atụmatụ

Ezigbo okpomoku okpomoku

ezigbo mma

Ezuru oke azụ azụ

hydrolysis na subheamed steased na-eguzogide

ike siri ike

iguzogide megide radieshon dị elu

ezigbo slide ma na-eyi ihe

na-eguzogide dị elu


Izu ụlọ

Teknụzụ semiconder


Tecpiek®cmp nke teknụzụ teknụzụ



Mechanical Properties
UNIT PARAMETER NORM
Modulus of elasticity 4100 MPa 1mm/min DIN EN ISO 527-2 
(tensile test)
Tensile strength 110 MPa 50mm/min DIN EN ISO 527-2
Tensile strength at yield 110 MPa 50mm/min DIN EN ISO 527-2
Elongation at yield (tensile test) 4 % 50mm/min DIN EN ISO 527-2
Elongation at break (tensile test) 50 % 50mm/min DIN EN ISO 527-2
Flexural strength 160 MPa 2mm/min, 10 N DIN EN ISO 178 
Modulus of elasticity 3900 MPa 2mm/min, 10 N DIN EN ISO 178
(flexural test)
Compression modulus 3200 MPa 5mm/min, 10 N EN ISO 604 
Impact strength (Charpy) n.b. kJ/m2 max. 7,5J DIN EN ISO 179-1eU 
Ball indentation hardness 240 MPa ISO 2039-1 
Compression strength 15 - 34 MPa 1% / 2% EN ISO 604 
Thermal Properties
VALUE UNIT PARAMETER NORM
Glass transition temperature 151 C DIN EN ISO 11357
Melting temperature 340 C DIN EN ISO 11357
Heat distortion temperature 162 C HDT, Method A ISO-R 75 Method A
Thermal conductivity 0.27 W/(k*m) ISO 22007-4:2008
Specific heat 1.1 J/(g*K) ISO 22007-4:2008
Service temperature 300 C short term NN 
Service temperature 260 C long term NN
Thermal expansion (CLTE) 5 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
Thermal expansion (CLTE) 6 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
Thermal expansion (CLTE) 7 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
ELECTRICAL PROPERTIES
VALUE UNIT PARAMETER NORM
surface resistivity 1015 Silver electrode, 23°C, 12% r.h. - 
volume resistivity 1015 Ω*cm Silver electrode, 23°C, 12% r.h. -
Dielectric strength 73 kV/mm 23°C, 50% r.h. ISO 60243-1 
Resistance to tracking (CTI) 125 V Platin electrode, 23°C, 50% r.h., solvent A DIN EN 60112
Other Properties
UNIT PARAMETER NORM
Resistance to hot water/ bases + - - 
Resistance to weathering - - - 
Water absorption 0.02 - 0.03 % 24h / 96h (23°C) DIN EN ISO 62




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